Chin. J. Semicond. > Volume 19 > Issue 8 > Article Number: 625

IC缺陷轮廓的盒维数及其方向的分布特征

姜晓鸿 , 郝跃 and 徐国华

+ Author Affiliations + Find other works by these authors

PDF

Abstract: 为了进行有效的集成电路(IC)成品率预报及故障分析,与光刻有关的硅片表面缺陷通常被假定为圆形的或方形的.然而,真实的缺陷的形貌是多种多样的.本文讨论了缺陷轮廓所具有的分形特征.该结果为硅片表面缺陷的精细表征及其计算机模拟作了有益的探索

Search

Advanced Search >>

Article Metrics

Article views: 1304 Times PDF downloads: 1074 Times Cited by: 0 Times

History

Manuscript received: 18 August 2015 Manuscript revised: Online: Published: 01 August 1998

Email This Article

User name:
Email:*请输入正确邮箱
Code:*验证码错误