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Chin. J. Semicond. > Volume 19 > Issue 8 > Article Number: 625

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IC缺陷轮廓的盒维数及其方向的分布特征

姜晓鸿 , 郝跃 and 徐国华

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Abstract: 为了进行有效的集成电路（ＩＣ）成品率预报及故障分析，与光刻有关的硅片表面缺陷通常被假定为圆形的或方形的．然而，真实的缺陷的形貌是多种多样的．本文讨论了缺陷轮廓所具有的分形特征．该结果为硅片表面缺陷的精细表征及其计算机模拟作了有益的探索

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History

Manuscript received: 18 August 2015 Manuscript revised: Online: Published: 01 August 1998

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