Abstract: 为了进行有效的集成电路(IC)成品率预报及故障分析,与光刻有关的硅片表面缺陷通常被假定为圆形的或方形的.然而,真实的缺陷的形貌是多种多样的.本文讨论了缺陷轮廓所具有的分形特征.该结果为硅片表面缺陷的精细表征及其计算机模拟作了有益的探索
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Manuscript received: 18 August 2015 Manuscript revised: Online: Published: 01 August 1998
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