Citation: |
Zhao Zhigang, Guo Jinchuan, Lei Yaohu, Niu Hanben. Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers[J]. Journal of Semiconductors, 2010, 31(7): 076001. doi: 10.1088/1674-4926/31/7/076001
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Zhao Z G, Guo J C, Lei Y H, Niu H B. Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers[J]. J. Semicond., 2010, 31(7): 076001. doi: 10.1088/1674-4926/31/7/076001.
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Photoelectrochemical etching of uniform macropore array on full 5-inch silicon wafers
DOI: 10.1088/1674-4926/31/7/076001
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Abstract
We analyze the two main factors causing non-uniformity of the etched macropore array first, and then a novel photoelectrochemical etching setup for large area silicon wafers is described. This etching setup refined typical etching setups by a water cooling system and a shower-head shaped electrolyte circulator. Experimental results showed that the uniform macropore array on full 5-inch n-type silicon wafers could be fabricated by this etching setup. The morphology of the macropore array can be controlled by adjusting the corresponding etching parameters. -
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