Citation: |
Tianxi Wang, Mei Han, Gaowei Xu, Le Luo. Fabrication of a microstrip patch antenna integrated in low-resistance silicon wafer using a BCB dielectric[J]. Journal of Semiconductors, 2013, 34(10): 104008. doi: 10.1088/1674-4926/34/10/104008
****
T X Wang, M Han, G W Xu, L Luo. Fabrication of a microstrip patch antenna integrated in low-resistance silicon wafer using a BCB dielectric[J]. J. Semicond., 2013, 34(10): 104008. doi: 10.1088/1674-4926/34/10/104008.
|
Fabrication of a microstrip patch antenna integrated in low-resistance silicon wafer using a BCB dielectric
DOI: 10.1088/1674-4926/34/10/104008
More Information
-
Abstract
This paper demonstrates a technique for microstrip patch antenna fabrication using a benzocyclobutene (BCB) dielectric. The most distinctive feature of this method is that the antenna is integrated on a low-resistance silicon wafer, and is fully compatible with the microwave multi-chip module packaging process. Low-permittivity dielectric BCB with excellent thermal and mechanical stability is employed to enhance the performance of the antenna. The as-fabricated antenna is characterized, and the experimental results show that the antenna resonates at 14.9 GHz with a 1.67% impedance bandwidth. -
References
[1] Rao R T, Madhavan S. Introduction to system-on-package (SoP):miniaturization of the entire system. USA:McGraw-Hill Prof Med/Tech, 2008, 3:81[2] Carchon G J, Raedt W D, Beyne E. Wafer-level packaging technology for high-Q on-chip inductors and transmission lines. IEEE Trans Microw Theory Tech, 2004, 52:1244 doi: 10.1109/TMTT.2004.825656[3] Ding X Y, Geng F, Luo L. Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate Microelectron Eng, 2009, 86: 335[4] Geng F, Ding X Y, Xu G W, et al. A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications. J Micromech Microeng, 2009, 19:105011 doi: 10.1088/0960-1317/19/10/105011[5] Carrillo-Ramirez R, Jackson R W. A technique for interconnecting millimeter wave integrated circuits using BCB and bump bonds. IEEE Microw Wirel Compon Lett, 2003, 13:196 doi: 10.1109/LMWC.2003.811677[6] Ju C W, Park S S, Kim S J, et al. Effects of O2C2F6 plasma descum with RF cleaning on via formation in MCM-D substrate using photosensitive BCB. Electronic Components and Technology Conf. Orlando, FL, USA, 2001:1216[7] Tang J J, Ding X Y, Geng F, et al. Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP. Microsyst Technol, 2012, 18:119 doi: 10.1007/s00542-011-1370-3[8] Tilmans H A C, De Raedt W, Beyne E. MEMS for wireless communications:'from RF-MEMS components to RF-MEMS-SiP'. J Micromech Microeng, 2003, 13:S139 http://cat.inist.fr/?aModele=afficheN&cpsidt=14901609[9] Tang J J, Sun X W, Luo L. A wafer level multi-chip module process with thick photosensitive benzocyclobutene as dielectric for microwave application. J Micromech Microeng, 2011, 21:065035 doi: 10.1088/0960-1317/21/6/065035[10] Wadell B C. Transmission-line design handbook. Boston:Artech House, 1991 http://ci.nii.ac.jp/ncid/BA51343143 -
Proportional views