J. Semicond. > 2013, Volume 34 > Issue 8 > 084005
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SEMICONDUCTOR DEVICES

A vertically integrated capacitorless memory cell

Xiaodong Tong, Hao Wu, Lichuan Zhao, Ming Wang and Huicai Zhong

+ Author Affiliations

 Corresponding author: Tong Xiaodong, Email:tongxiaodong@ime.ac.cn

DOI: 10.1088/1674-4926/34/8/084005

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Abstract: A two-port capacitorless PNPN device with high density, high speed and low power memory fabricated using standard CMOS technology is presented. Experiments and calibrated simulations were conducted which prove that this new memory cell has a high operation speed (ns level), large read current margin (read current ratio of 104×), low process variation, good thermal reliability and available retention time (190 ms). Furthermore, the new memory cell is free of the cyclic endurance/reliability problems induced by hot-carrier injection due to the gateless structure.

Key words: PNPN diode, two-port, cross-point



[1]
Ban I, Avci U E, Kencke D L, et al. A scaled floating body cell (FBC) memory with high-k + metal gate on thin-silicon and thin-BOX for 16-nm technology node and beyond. Symposium on VLSI Technology, 2008:92 http://ieeexplore.ieee.org/document/4588575/
[2]
Cho H J, Nemati F, Roy R, et al. A novel capacitor-less DRAM cell using thin capacitively-coupled thyristor (TCCT). IEEE International Electron Devices Meeting (IEDM), 2005 http://ieeexplore.ieee.org/abstract/document/1609337
[3]
Han J W, Choi Y K. Bistable resistor (biristor)-gateless silicon nanowire memory. Symposium on VLSI Technology, 2010:171 http://ieeexplore.ieee.org/document/5556215/?arnumber=5556215&filter%3DAND(p_IS_Number:5556114)%26pageNumber%3D3
[4]
Gibbons J F. A critique of the theory of p-n-p-n devices. IEEE Trans Electron Devices, 1964, 11(9):406 doi: 10.1109/T-ED.1964.15352
[5]
Kau D C, Tang S, Karpov I V, et al. A stackable cross point phase change memory. IEEE International Electron Devices Meeting (IEDM), 2009 https://www.infona.pl/resource/bwmeta1.element.ieee-art-000005424263
[6]
Tong X, Wu H, Liang Q, et al. On the design of 2-port SRAM memory cells using PNPN diodes for VLSI application. IEEE International Conference on Simulation of Semiconductor Processes and devices (SISPAD), Denver, CO, USA, 2012 doi: 10.1088/1674-4926/34/8/084005
[7]
Liang J, Jeyasingh R G D, Chen H Y, et al. An ultra-low reset current cross-point phase change memory with carbon nanotube electrodes. IEEE Trans Electron Devices, 2012, 59(4):1155 doi: 10.1109/TED.2012.2184542
[8]
Ielmini D. Modeling the universal set/reset characteristics of bipolar RRAM by field-and temperature driven filament growth. IEEE Trans Electron Devices, 1980, 27(5):939 doi: 10.1109/T-ED.1980.19960
[9]
Zhao Qiang, Zhou Maoxiu, Zhang Wei, et al. Effects of interaction between defects on the uniformity of doping HfO2-based RRAM:a first principle study. Journal of Semiconductors, 2013, 34(3):032001 doi: 10.1088/1674-4926/34/3/032001
[10]
Fu Cong, Song Zhitang, Chen Houpeng, et al. A novel low ripple charge pump with a 2X/1.5X booster for PCM. Journal of Semiconductors, 2012, 33(9):095001 doi: 10.1088/1674-4926/33/9/095001
[11]
TCAD Sentaurus User Manual. Synopsys Inc, 2010. 12
[12]
Srinivasaiah H C, Bhat N. Mixed-mode simulation approach to characterize the circuit delay sensitivity to implant dose variations. IEEE Trans Computer-Aided Design of Integrated Circuits and Systems, 2003, 22(6):742 doi: 10.1109/TCAD.2003.811453
Fig. 1.  (a) Schematic of the proposed DRAM memory cell. (b) SEM view of the fabricated cell. (c) The fabrication process flow on the standard CMOS line.

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Fig. 2.  (a) Hysteric $I$-$V$ curve of the fabricated memory cell. At $V_{\rm AC}$ $>$ 2 V, the current is constant because the actual current through the diode hits the compliance level of the SMU. (b) $I$-$V$ curves of the designed memory cell, with the two worst conditions.

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Fig. 3.  (a) Hysteric $I$-$V$ curves of the memory cell indicating good reliability, and (b) the high-temperature impact on the $I$-$V$ characteristics assuring the memory window up to 80 $℃$.

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Fig. 4.  The measurement schematic and operational conditions.

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Fig. 5.  (a) A sensing current window of about $10$$^{4}$ is shown after the program and erase, and (b) the read operations in and out of retention time.

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Fig. 6.  (a) Multiple sensing after the hold operation is enabled by the refresh property of the read. (b) Program and erase pulse width down to 200 ns, which ensures sufficient operation speeds.

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Fig. 7.  The ns level simulations of the new memory cell, which indicate that this new cell can be used in high-speed applications.

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Fig. 8.  A schematic of the vertical memory on a bulk substrate, shown for standalone memory.

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Table 1.   Main performance comparisons between the biristor and the memory cell proposed in this work. The new memory cell shows much lower operation power consumption due to the different physical mechanisms from the biristor.
[1]
Ban I, Avci U E, Kencke D L, et al. A scaled floating body cell (FBC) memory with high-k + metal gate on thin-silicon and thin-BOX for 16-nm technology node and beyond. Symposium on VLSI Technology, 2008:92 http://ieeexplore.ieee.org/document/4588575/
[2]
Cho H J, Nemati F, Roy R, et al. A novel capacitor-less DRAM cell using thin capacitively-coupled thyristor (TCCT). IEEE International Electron Devices Meeting (IEDM), 2005 http://ieeexplore.ieee.org/abstract/document/1609337
[3]
Han J W, Choi Y K. Bistable resistor (biristor)-gateless silicon nanowire memory. Symposium on VLSI Technology, 2010:171 http://ieeexplore.ieee.org/document/5556215/?arnumber=5556215&filter%3DAND(p_IS_Number:5556114)%26pageNumber%3D3
[4]
Gibbons J F. A critique of the theory of p-n-p-n devices. IEEE Trans Electron Devices, 1964, 11(9):406 doi: 10.1109/T-ED.1964.15352
[5]
Kau D C, Tang S, Karpov I V, et al. A stackable cross point phase change memory. IEEE International Electron Devices Meeting (IEDM), 2009 https://www.infona.pl/resource/bwmeta1.element.ieee-art-000005424263
[6]
Tong X, Wu H, Liang Q, et al. On the design of 2-port SRAM memory cells using PNPN diodes for VLSI application. IEEE International Conference on Simulation of Semiconductor Processes and devices (SISPAD), Denver, CO, USA, 2012 doi: 10.1088/1674-4926/34/8/084005
[7]
Liang J, Jeyasingh R G D, Chen H Y, et al. An ultra-low reset current cross-point phase change memory with carbon nanotube electrodes. IEEE Trans Electron Devices, 2012, 59(4):1155 doi: 10.1109/TED.2012.2184542
[8]
Ielmini D. Modeling the universal set/reset characteristics of bipolar RRAM by field-and temperature driven filament growth. IEEE Trans Electron Devices, 1980, 27(5):939 doi: 10.1109/T-ED.1980.19960
[9]
Zhao Qiang, Zhou Maoxiu, Zhang Wei, et al. Effects of interaction between defects on the uniformity of doping HfO2-based RRAM:a first principle study. Journal of Semiconductors, 2013, 34(3):032001 doi: 10.1088/1674-4926/34/3/032001
[10]
Fu Cong, Song Zhitang, Chen Houpeng, et al. A novel low ripple charge pump with a 2X/1.5X booster for PCM. Journal of Semiconductors, 2012, 33(9):095001 doi: 10.1088/1674-4926/33/9/095001
[11]
TCAD Sentaurus User Manual. Synopsys Inc, 2010. 12
[12]
Srinivasaiah H C, Bhat N. Mixed-mode simulation approach to characterize the circuit delay sensitivity to implant dose variations. IEEE Trans Computer-Aided Design of Integrated Circuits and Systems, 2003, 22(6):742 doi: 10.1109/TCAD.2003.811453

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    Received: 29 January 2013 Revised: 19 February 2013 Online: Published: 01 August 2013

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      Article Navigation >  Journal of Semiconductors  > 2013  >  34(8): 084005
      Xiaodong Tong, Hao Wu, Lichuan Zhao, Ming Wang, Huicai Zhong. A vertically integrated capacitorless memory cell[J]. Journal of Semiconductors, 2013, 34(8): 084005. doi: 10.1088/1674-4926/34/8/084005 ****X D Tong, H Wu, L C Zhao, M Wang, H C Zhong. A vertically integrated capacitorless memory cell[J]. J. Semicond., 2013, 34(8): 084005. doi: 10.1088/1674-4926/34/8/084005.
      Citation:
      Xiaodong Tong, Hao Wu, Lichuan Zhao, Ming Wang, Huicai Zhong. A vertically integrated capacitorless memory cell[J]. Journal of Semiconductors, 2013, 34(8): 084005. doi: 10.1088/1674-4926/34/8/084005 ****
      X D Tong, H Wu, L C Zhao, M Wang, H C Zhong. A vertically integrated capacitorless memory cell[J]. J. Semicond., 2013, 34(8): 084005. doi: 10.1088/1674-4926/34/8/084005.
      shu

      A vertically integrated capacitorless memory cell

      DOI: 10.1088/1674-4926/34/8/084005

      • Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

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      • Corresponding author: Tong Xiaodong, Email:tongxiaodong@ime.ac.cn
      • Received Date: 2013-01-29
      • Revised Date: 2013-02-19
      • Published Date: 2013-08-01

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