Citation: |
Jun Li, Xingchang Wei, Yufei Shu. Equivalent radiation source of 3D package for electromagnetic characteristics analysis[J]. Journal of Semiconductors, 2017, 38(10): 105010. doi: 10.1088/1674-4926/38/10/105010
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J Li, X C Wei, Y F Shu. Equivalent radiation source of 3D package for electromagnetic characteristics analysis[J]. J. Semicond., 2017, 38(10): 105010. doi: 10.1088/1674-4926/38/10/105010.
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Equivalent radiation source of 3D package for electromagnetic characteristics analysis
DOI: 10.1088/1674-4926/38/10/105010
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Abstract
An equivalent radiation source method is proposed to characterize electromagnetic emission and interference of complex three dimensional integrated circuits (IC) in this paper. The method utilizes amplitude-only near-field scanning data to reconstruct an equivalent magnetic dipole array, and the differential evolution optimization algorithm is proposed to extract the locations, orientation and moments of those dipoles. By importing the equivalent dipoles model into a 3D full-wave simulator together with the victim circuit model, the electromagnetic interference issues in mixed RF/digital systems can be well predicted. A commercial IC is used to validate the accuracy and efficiency of this proposed method. The coupled power at the victim antenna port calculated by the equivalent radiation source is compared with the measured data. Good consistency is obtained which confirms the validity and efficiency of the method. -
References
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