Citation: |
Chen Gang, Li Zheyang, Bai Song, Ren Chunjiang. Ti/4H-SiC Schottky Barrier Diodes with Field Plate and B+ Implantation Edge Termination Technology[J]. Journal of Semiconductors, 2007, 28(9): 1333-1336.
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Chen G, Li Z Y, Bai S, Ren C J. Ti/4H-SiC Schottky Barrier Diodes with Field Plate and B+ Implantation Edge Termination Technology[J]. Chin. J. Semicond., 2007, 28(9): 1333.
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Ti/4H-SiC Schottky Barrier Diodes with Field Plate and B+ Implantation Edge Termination Technology
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Abstract
This paper describes the fabrication and electrical characteristics of Ti/4H-SiC Schottky barrier diodes (SBDs).The ideality factor n=1.08 and effective Schottky barrier height φ=1.05eV of the SBDs were measured with the method of forward current density-voltage (J-V).A low reverse leakage current below 5.96e-3A/cm2 at a bias voltage of -1.1kV was obtained.By using B+ implantation,an amorphous layer as the edge termination was formed.We used the PECVD SiO2 as the field plate dielectric.The SBDs have an on-state current density of 430A/cm2 at a forward voltage drop of about 4V.The specific on-resistance Ron was found to be 6.77mΩ·cm2.-
Keywords:
- 4H-SiC,
- Schottky barrier,
- ideal factor,
- barrier height,
- implantation
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References
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Proportional views