Chin. J. Semicond. > 2005, Volume 26 > Issue 5 > 1033-1039
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焊料键合实现MEMS真空封装的模拟

程迎军 , 蒋玉齐 , 许薇 and 罗乐

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Key words: MEMS, 真空, 封装, 模拟

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    Received: 19 August 2015 Revised: Online: Published: 01 May 2005

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      Article Navigation >  Journal of Semiconductors  > 2005  >  26(5): 1033-1039
      程迎军, 蒋玉齐, 许薇, 罗乐. 焊料键合实现MEMS真空封装的模拟[J]. 半导体学报(英文版), 2005, 26(5): 1033-1039.
      Citation:
      程迎军, 蒋玉齐, 许薇, 罗乐. 焊料键合实现MEMS真空封装的模拟[J]. 半导体学报(英文版), 2005, 26(5): 1033-1039.
      shu

      • Received Date: 2015-08-19

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