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Volume 26, Issue 5, May 2005
CONTENTS
Widely Tunable Sampled-Grating DBR Laser
Kan Qiang, Zhao Lingjuan, Zhang Jing, Zhou Fan, Wang Baojun, Wang Lufeng,and Wang Wei
Chin. J. Semicond.  2005, 26(5): 853-857
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A Novel Local-Dielectric-Thickening Technique for Performance Improvements of Spiral Inductors on Si Substrates
Yang, Rong,Li, Junfeng,Zhao, Yuyin,Chai, Shumin,Han, Zhengsheng,and, Qian, He
Chin. J. Semicond.  2005, 26(5): 857-861
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Sensitivity of Total-Dose Radiation Hardness of SIMOX Buried Oxides to Doses of Nitrogen Implantation into Buried Oxides
Zheng Zhongshan, Liu Zhongli, Zhang Guoqiang, Li Ning, Li Guohua, Ma Hongzhi, Zhang Enxia, Zhang Zhengxuan, Wang Xi
Chin. J. Semicond.  2005, 26(5): 862-866
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In order to improve the total-dose radiation hardness of the buried oxides(BOX) in the structure of separation by implanted oxygen(SIMOX) silicon-on-insulator(SOI),nitrogen ions are implanted into the buried oxides with two different doses,2e15 and 3e15cm-2,respectively.The experimental results show that the radiation hardness of the buried oxides is very sensitive to the doses of nitrogen implantation for a lower dose of irradiation with a Co60 source.Despite the small difference between the doses of nitrogen implantation,the nitrogen-implanted 2e15cm-2 BOX has a much higher hardness than the control sample (i.e.the buried oxide without receiving nitrogen implantation) for a totaldose irradiation of 5e4rad(Si),whereas the nitrogen-implanted 3e15cm-2 BOX has a lower hardness than the control sample.However,this sensitivity of radiation hardness to the doses of nitrogen implantation reduces with the increasing totaldose of irradiation (from 5e4 to 5e5rad (Si)).The radiation hardness of BOX is characterized by MOS high-frequency (HF) capacitance-voltage (C-V) technique after the top silicon layers are removed.In addition,the abnormal HF C-V curve of the metalsiliconBOXsilicon(MSOS) structure is observed and explained.

In order to improve the total-dose radiation hardness of the buried oxides(BOX) in the structure of separation by implanted oxygen(SIMOX) silicon-on-insulator(SOI),nitrogen ions are implanted into the buried oxides with two different doses,2e15 and 3e15cm-2,respectively.The experimental results show that the radiation hardness of the buried oxides is very sensitive to the doses of nitrogen implantation for a lower dose of irradiation with a Co60 source.Despite the small difference between the doses of nitrogen implantation,the nitrogen-implanted 2e15cm-2 BOX has a much higher hardness than the control sample (i.e.the buried oxide without receiving nitrogen implantation) for a totaldose irradiation of 5e4rad(Si),whereas the nitrogen-implanted 3e15cm-2 BOX has a lower hardness than the control sample.However,this sensitivity of radiation hardness to the doses of nitrogen implantation reduces with the increasing totaldose of irradiation (from 5e4 to 5e5rad (Si)).The radiation hardness of BOX is characterized by MOS high-frequency (HF) capacitance-voltage (C-V) technique after the top silicon layers are removed.In addition,the abnormal HF C-V curve of the metalsiliconBOXsilicon(MSOS) structure is observed and explained.
An Accurate 1.08GHz CMOS LC Voltage-Controlled Oscillator
Tang Zhangwen, He Jie, Jian Hongyan, and Min Hao
Chin. J. Semicond.  2005, 26(5): 867-872
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Design and Realization of a Monolithic GaAs 3Bit Phase Digitizing DAC
Zhang, Youtao,Xia, Guanqun,Li, Fuxiao,Gao, Jianfeng,and, Yang, Naibin
Chin. J. Semicond.  2005, 26(5): 873-876
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A New Low Voltage RF CMOS Mixer Design
Liu, Lu, and, Wang, Zhihua
Chin. J. Semicond.  2005, 26(5): 877-880
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Strained-Si pMOSFETs on Very Thin Virtual SiGe Substrates
Li Jingchun, Tan Jing, Yang Mohua, Zhang Jing,and Xu Wanjing
Chin. J. Semicond.  2005, 26(5): 881-885
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An Asynchronous Implementation of Add-Compare-Select Processor for Communication Systems
Zhao Bing, Qiu Yulin, Lü Tieliang, and Hei Yong
Chin. J. Semicond.  2005, 26(5): 886-892
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Theoretical Analysis of Effect of LUT Size on Area and Delay of FPGA
Gao, Haixia,Yang, Yintang,and, Dong, Gang
Chin. J. Semicond.  2005, 26(5): 893-898
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An Alternative Method for SU-8 Removal Using PDMS Technique
Li Jianhua, Chen Di, Zhang Jinya, Liu Jingquan, and Zhu Jun
Chin. J. Semicond.  2005, 26(5): 899-903
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液相外延HgCdTe薄膜组分均匀性对红外透射光谱的影响
王庆学, 魏彦锋, 杨建荣, 何力
Chin. J. Semicond.  2005, 26(5): 904-909
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高碳CZ硅中氧沉淀的两种成核长大机制
刘培东, 姜益群, 黄笑容, 沈益军, 李立本, 阙端麟
Chin. J. Semicond.  2005, 26(5): 910-916
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色散对GaN和ZnO的XRD摇摆曲线的影响
王立, 方文卿, 蒲勇, 郑畅达, 戴江南, 莫春兰, 江风益
Chin. J. Semicond.  2005, 26(5): 917-921
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SnO2∶Sb薄膜的制备和光致发光性质
王玉恒, 马瑾, 计峰, 余旭浒, 张锡健, 马洪磊
Chin. J. Semicond.  2005, 26(5): 922-926
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硅纳米晶的制备和电荷储存特性
焦正, 李珍, 吴明红, 吕森林, 王德庆
Chin. J. Semicond.  2005, 26(5): 927-930
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Si基氨化ZnO/Ga2O3薄膜制备GaN纳米线
高海永, 庄惠照, 薛成山, 王书运, 何建廷, 董志华, 吴玉新, 田德恒
Chin. J. Semicond.  2005, 26(5): 931-935
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水平冷壁CVD生长4H-SiC同质外延膜
高欣, 孙国胜, 李晋闽, 赵万顺, 王雷, 张永兴, 曾一平
Chin. J. Semicond.  2005, 26(5): 936-940
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利用p型(100)硅片制备二维光子晶体的工艺
张晚云, 季家榕, 袁晓东, 叶卫民, 朱志宏
Chin. J. Semicond.  2005, 26(5): 941-946
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(100)定向CVD金刚石薄膜的制备及其电学性能
苏青峰, 夏义本, 王林军, 张明龙, 楼燕燕, 顾蓓蓓, 史伟民
Chin. J. Semicond.  2005, 26(5): 947-951
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VHF-PECVD制备微晶硅材料及电池
张晓丹, 赵颖, 朱锋, 魏长春, 高艳涛, 孙健, 侯国付, 薛俊明, 耿新华, 熊绍珍
Chin. J. Semicond.  2005, 26(5): 952-957
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渐变带隙结构在Ⅲ-Ⅴ族太阳电池中的应用
彭华, 周之斌, 崔容强, 叶庆好, 庞乾骏, 陈鸣波, 赵亮
Chin. J. Semicond.  2005, 26(5): 958-964
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p型GaN欧姆接触的比接触电阻率测量
薛松, 韩彦军, 吴震, 罗毅
Chin. J. Semicond.  2005, 26(5): 965-969
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微量铜-铁对硅片表面污染的初步分析
郑宣, 程璇
Chin. J. Semicond.  2005, 26(5): 970-976
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径向三重流MOCVD反应器输运过程的数值模拟
左然, 张红, 刘祥林
Chin. J. Semicond.  2005, 26(5): 977-982
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基于C-V, I-V, Q-V特性的铁电电容新模型
陈小明, 汤庭鳌
Chin. J. Semicond.  2005, 26(5): 983-989
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基于FC技术的AlGaN/GaN HEMT
陈晓娟, 刘新宇, 邵刚, 刘键, 和致经, 汪锁发, 吴德馨
Chin. J. Semicond.  2005, 26(5): 990-993
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一种简化的VBIC模型和InGaP/GaAs HBT宽带放大器设计
孙玲玲, 刘军
Chin. J. Semicond.  2005, 26(5): 994-998
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恒压应力下超薄栅nMOSFET软击穿后的衬底电流特性
王彦刚, 许铭真, 谭长华, 段小蓉
Chin. J. Semicond.  2005, 26(5): 999-1004
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pMOS器件的热载流子注入和负偏压温度耦合效应
刘红侠, 郝跃
Chin. J. Semicond.  2005, 26(5): 1005-1009
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双极晶体管ΔVbe瞬态热阻测试法精度修正
李霁红, 贾颖, 康锐, 高成
Chin. J. Semicond.  2005, 26(5): 1010-1014
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三沟道体电荷耦合器件在近红外光区光电特性的数值模拟
宋敏, 张颖, 王玉新, 郑亚茹
Chin. J. Semicond.  2005, 26(5): 1015-1019
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50/100GHz AWG型光学梳状滤波器的设计与制备
窦金锋, 韩培德, 胡雄伟
Chin. J. Semicond.  2005, 26(5): 1020-1023
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850nm氧化物限制型VCSEL的温度特性
张永明, 钟景昌, 赵英杰, 郝永芹, 李林, 王玉霞, 苏伟
Chin. J. Semicond.  2005, 26(5): 1024-1027
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MEMS多层膜残余应力全场光学在线测试
聂萌, 黄庆安, 李伟华
Chin. J. Semicond.  2005, 26(5): 1028-1032
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焊料键合实现MEMS真空封装的模拟
程迎军, 蒋玉齐, 许薇, 罗乐
Chin. J. Semicond.  2005, 26(5): 1033-1039
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一种改进的旋转式微机械结构
刘祖韬, 黄庆安, 李伟华
Chin. J. Semicond.  2005, 26(5): 1040-1044
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一种2.4GHz 0.35μm CMOS Gilbert下变频器
崔福良, 黄林, 马德群, 洪志良
Chin. J. Semicond.  2005, 26(5): 1045-1048
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一种2.4GHz的CMOS注入锁频倍频器
衣晓峰, 苏彦锋, 朱臻, 洪志良
Chin. J. Semicond.  2005, 26(5): 1049-1053
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考虑缺陷形状分布的IC成品率模型
王俊平, 郝跃
Chin. J. Semicond.  2005, 26(5): 1054-1058
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应用于MEMS的单晶硅上无电镀铜、镀镍工艺
韩翔, 李轶, 吴文刚, 闫桂珍, 郝一龙
Chin. J. Semicond.  2005, 26(5): 1059-1064
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厚层抗蚀剂曝光模型及其参数测量
刘世杰, 杜惊雷, 段茜, 罗铂靓, 唐雄贵, 郭永康, 杜春雷
Chin. J. Semicond.  2005, 26(5): 1065-1071
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