1 |
Double humps and radiation effects of SOI NMOSFET
Cui Jiangwei, Yu Xuefeng, Ren Diyuan, He Chengfa, Gao Bo, et al.
Journal of Semiconductors, 2011, 32(6): 064006. doi: 10.1088/1674-4926/32/6/064006
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2 |
A new integrated SOI power device based on self-isolation technology
Gao Huanmei, Luo Xiaorong, Zhang Wei, Deng Hao, Lei Tianfei, et al.
Journal of Semiconductors, 2010, 31(8): 084012. doi: 10.1088/1674-4926/31/8/084012
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3 |
Process optimization of a deep trench isolation structure for high voltage SOI devices
Zhu Kuiying, Qian Qinsong, Zhu Jing, Sun Weifeng
Journal of Semiconductors, 2010, 31(12): 124009. doi: 10.1088/1674-4926/31/12/124009
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4 |
A New High Voltage SOI Device with a Nonuniform Thickness Drift Region and Its Optimization
Luo Xiaorong, Zhang Wei, Zhang Bo, Li Zhaoji, Yan Bin, et al.
Journal of Semiconductors, 2008, 29(10): 1902-1906.
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5 |
Fabrication of a Novel SOI Material with Non-Planar Buried Oxide Layer
Guo Yufeng, Li Zhaoji, Zhang Bo, Liu Yong
Chinese Journal of Semiconductors , 2007, 28(9): 1415-1419.
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6 |
Dual Material Gate SOI MOSFET with a Single Halo
Li Zunchao, Jiang Yaolin, Wu Jianmin
Chinese Journal of Semiconductors , 2007, 28(3): 327-331.
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7 |
A Continuous and Analytical Surface Potential Model for SOI LDMOS
Xu Wenjie, Sun Lingling, Liu Jun, Li Wenjun, Zhang Haipeng, et al.
Chinese Journal of Semiconductors , 2007, 28(11): 1712-1716.
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8 |
Fabrication of Monolithic Silicon Multi-Sensor on SOI Wafer
Xu Jingbo, Zhao Yulong, Jiang Zhuangde, Zhang Dacheng, Yang Fang, et al.
Chinese Journal of Semiconductors , 2007, 28(2): 302-307.
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9 |
Total Dose Irradiation of FD SOI NMOSFET UnderDifferent Bias Configurations
Wang Ningjuan, Liu Zhongli, Li Ning, Yu Fang, Li Guohua, et al.
Chinese Journal of Semiconductors , 2007, 28(5): 750-754.
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10 |
A Patterned SOI LDMOSFET by Masked SIMOX for RF Power Applications
Li Wenjun, Sun Lingling, Liu Jun
Chinese Journal of Semiconductors , 2007, 28(4): 480-483.
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11 |
Effects of Si Ion Implantation on the Total-Dose Radiation Properties of SIMOX SOI Materials
Yang Hui, Zhang Enxia, Zhang Zhengxuan
Chinese Journal of Semiconductors , 2007, 28(3): 323-326.
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12 |
An ADI Method for the Breakdown Voltage Analysis of Thin-Film SOI RESURF Structure with the High-Order Compact Finite Difference
Yu Zongguang, Liu Zhan, Wang Guozhang, Xu Ziming
Chinese Journal of Semiconductors , 2006, 27(2): 354-357.
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13 |
Fabrication of SOI Material Using Low Temperature Bonding Technology
Zhan Da, Ma Xiaobo, Liu Weili, Song Zhitang, Feng Songlin, et al.
Chinese Journal of Semiconductors , 2006, 27(S1): 189-192.
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14 |
Study of Improved Performance of SOI Devices and Circuits
Hai Chaohe, Han Zhengsheng, Zhou Xiaoyin, Zhao Lixin, Li Duoli, et al.
Chinese Journal of Semiconductors , 2006, 27(S1): 322-327.
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15 |
Study on the Characteristics of SOI DTMOS with Reverse Schottky Barriers
Bi Jinshun, Hai Chaohe
Chinese Journal of Semiconductors , 2006, 27(9): 1526-1530.
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16 |
SOI MOSFET Model Parameter Extraction via a Compound Genetic Algorithm
Li Ruizhen, Li Duoli, Du Huan, Hai Chaohe, Han Zhengsheng, et al.
Chinese Journal of Semiconductors , 2006, 27(5): 796-803.
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17 |
A High Breakdown Voltage Thin SOI Device with a Vertically Linearly Graded Concentration Drift Region
Lu Shengli, Sun Zhilin, Sun Weifeng, Shi Longxing
Chinese Journal of Semiconductors , 2005, 26(12): 2286-2289.
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18 |
Characteristics of a 0.1μm SOI Grooved Gate pMOSFET
Shao Hongxu, Sun Baogang, Wu Junfeng, Zhong Xinghua
Chinese Journal of Semiconductors , 2005, 26(11): 2080-2084.
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19 |
Sensitivity of Total-Dose Radiation Hardness of SIMOX Buried Oxides to Doses of Nitrogen Implantation into Buried Oxides
Zheng Zhongshan, Liu Zhongli, Zhang Guoqiang, Li Ning, Li Guohua, et al.
Chinese Journal of Semiconductors , 2005, 26(5): 862-866.
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20 |
A Modified DSOI Device
JIANG Bo, HE Ping, TIAN Li-lin, LIN Xi
Chinese Journal of Semiconductors , 2002, 23(9): 966-971.
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