Chin. J. Semicond. > 2005, Volume 26 > Issue 4 > 840-845
|

CONTENTS

新型多晶硅薄膜热膨胀系数在线测试结构

张宇星 , 黄庆安 and 李伟华

+ Author Affiliations

PDF

Key words: MEMS, 多晶硅, 热膨胀系数, 在线检测

    • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 2587 Times PDF downloads: 1541 Times Cited by: 0 Times

    History

    Received: 19 August 2015 Revised: Online: Published: 01 April 2005

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Send
      Article Navigation >  Journal of Semiconductors  > 2005  >  26(4): 840-845
      张宇星, 黄庆安, 李伟华. 新型多晶硅薄膜热膨胀系数在线测试结构[J]. 半导体学报(英文版), 2005, 26(4): 840-845.
      Citation:
      张宇星, 黄庆安, 李伟华. 新型多晶硅薄膜热膨胀系数在线测试结构[J]. 半导体学报(英文版), 2005, 26(4): 840-845.
      shu

      • Received Date: 2015-08-19

      Catalog

        Journal of Semiconductors © 2017 All Rights Reserved   京ICP备05085259号-2

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return