Chin. J. Semicond. > 2003, Volume 24 > Issue 11 > 1121-1129

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深亚微米工艺下互连线串扰问题的研究与进展(英文)

蔡懿慈 , 赵鑫 and 洪先龙

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Key words: 互连线串扰, 串扰噪声, Keff模型, RLC精确噪声模型

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    Received: 20 August 2015 Revised: Online: Published: 01 November 2003

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      Article Navigation >  Journal of Semiconductors  > 2003  >  24(11): 1121-1129
      蔡懿慈, 赵鑫, 洪先龙. 深亚微米工艺下互连线串扰问题的研究与进展(英文)[J]. 半导体学报(英文版), 2003, 24(11): 1121-1129.
      Citation:
      蔡懿慈, 赵鑫, 洪先龙. 深亚微米工艺下互连线串扰问题的研究与进展(英文)[J]. 半导体学报(英文版), 2003, 24(11): 1121-1129.
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      • Received Date: 2015-08-20

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