Chin. J. Semicond. > 2004, Volume 25 > Issue 3 > 340-345
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倒装芯片各向异性导电胶互连的剪切结合强度

吴丰顺 , 吴懿平 , 邬博义 and 陈力

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Key words: 各向异性导电胶膜, 剪切强度, 玻璃上倒装芯片, 柔性基板上倒装芯片

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    吴丰顺, 吴懿平, 邬博义, 陈力. 倒装芯片各向异性导电胶互连的剪切结合强度[J]. 半导体学报(英文版), 2004, 25(3): 340-345.
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    Received: 19 August 2015 Revised: Online: Published: 01 March 2004

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      Article Navigation >  Journal of Semiconductors  > 2004  >  25(3): 340-345
      吴丰顺, 吴懿平, 邬博义, 陈力. 倒装芯片各向异性导电胶互连的剪切结合强度[J]. 半导体学报(英文版), 2004, 25(3): 340-345.
      Citation:
      吴丰顺, 吴懿平, 邬博义, 陈力. 倒装芯片各向异性导电胶互连的剪切结合强度[J]. 半导体学报(英文版), 2004, 25(3): 340-345.
      shu

      • Received Date: 2015-08-19

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