Chin. J. Semicond. > 2001, Volume 22 > Issue 7 > 821-825
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智能剥离工艺的热动力学模型(英文)

韩伟华 and 余金中

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Key words: 热动力学, 智能剥离, 剥离时间, 劈裂温度

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    韩伟华, 余金中. 智能剥离工艺的热动力学模型(英文)[J]. 半导体学报(英文版), 2001, 22(7): 821-825.
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    Received: 20 August 2015 Revised: Online: Published: 01 July 2001

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      Article Navigation >  Journal of Semiconductors  > 2001  >  22(7): 821-825
      韩伟华, 余金中. 智能剥离工艺的热动力学模型(英文)[J]. 半导体学报(英文版), 2001, 22(7): 821-825.
      Citation:
      韩伟华, 余金中. 智能剥离工艺的热动力学模型(英文)[J]. 半导体学报(英文版), 2001, 22(7): 821-825.
      shu

      • Received Date: 2015-08-20

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