Chin. J. Semicond. > 2003, Volume 24 > Issue 1 > 90-97
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填充不流动胶的倒装焊封装中芯片的断裂问题

彩霞 , 黄卫东 , 徐步陆 and 程兆年

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Key words: 芯片断裂, 不流动胶, 封装翘曲, 能量释放率, 应力强度因子

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    Received: 20 August 2015 Revised: Online: Published: 01 January 2003

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      Article Navigation >  Journal of Semiconductors  > 2003  >  24(1): 90-97
      彩霞, 黄卫东, 徐步陆, 程兆年. 填充不流动胶的倒装焊封装中芯片的断裂问题[J]. 半导体学报(英文版), 2003, 24(1): 90-97.
      Citation:
      彩霞, 黄卫东, 徐步陆, 程兆年. 填充不流动胶的倒装焊封装中芯片的断裂问题[J]. 半导体学报(英文版), 2003, 24(1): 90-97.
      shu

      • Received Date: 2015-08-20

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