Chin. J. Semicond. > 2001, Volume 22 > Issue 1 > 107-112

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倒装焊SnPb焊点热循环失效和底充胶的影响

陈柳 , 张群 , 王国忠 , 谢晓明 and 程兆年

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Key words: 倒装焊, SnPb焊点, 底充胶, 热循环, 有限元模拟

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    Received: 19 August 2015 Revised: Online: Published: 01 January 2001

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      Article Navigation >  Journal of Semiconductors  > 2001  >  22(1): 107-112
      陈柳, 张群, 王国忠, 谢晓明, 程兆年. 倒装焊SnPb焊点热循环失效和底充胶的影响[J]. 半导体学报(英文版), 2001, 22(1): 107-112.
      Citation:
      陈柳, 张群, 王国忠, 谢晓明, 程兆年. 倒装焊SnPb焊点热循环失效和底充胶的影响[J]. 半导体学报(英文版), 2001, 22(1): 107-112.
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      • Received Date: 2015-08-19

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