| Citation: |
Hu Xiuzhen, Li Zhiguo, Guo Chunsheng, Wu Yuehua, Liao Jingning. FEA Method in the 3D Thermal Simulation of MCM[J]. Journal of Semiconductors, 2006, 27(S1): 351-353.
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Hu X Z, Li Z G, Guo C S, Wu Y H, Liao J N. FEA Method in the 3D Thermal Simulation of MCM[J]. Chin. J. Semicond., 2006, 27(13): 351.
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FEA Method in the 3D Thermal Simulation of MCM
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Abstract
The reliability of multi-chip module (MCM),especially thermal reliability,has become one of the keys to the reliability research of electronic product.Finite element analysis is an important tool in the thermal analysis of MCM.A three dimensional thermal model of a kind of MCM was built with ANSYS to calculate the temperature distribution.By thermal simulation and thermal analysis,we can raise a project to improve the temperature field-
Keywords:
- MCM,
- finite element analysis,
- ANSYS,
- thermal simulation,
- thermal analysis
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References
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Proportional views
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