Chin. J. Semicond. > 1998, Volume 19 > Issue 6 > 463-467
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8-羟基喹啉铝/镁结接触特性研究

张立功 , 刘学彦 , 蒋大鹏 , 吕安德 and 元金山

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    Received: 18 August 2015 Revised: Online: Published: 01 June 1998

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      Article Navigation >  Journal of Semiconductors  > 1998  >  19(6): 463-467
      张立功, 刘学彦, 蒋大鹏, 吕安德, 元金山. 8-羟基喹啉铝/镁结接触特性研究[J]. 半导体学报(英文版), 1998, 19(6): 463-467.
      Citation:
      张立功, 刘学彦, 蒋大鹏, 吕安德, 元金山. 8-羟基喹啉铝/镁结接触特性研究[J]. 半导体学报(英文版), 1998, 19(6): 463-467.
      shu

      • Received Date: 2015-08-18

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