Si-Glass Hermetic Package with the Benzo-Cyclo-Butene Material

Liu Yufei; Liu Wenping; Li Sihua; Wu Yaming; Luo Le

State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China
Graduate University of the Chinese Academy of Sci
State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China
Graduate University of the Chinese Academy of Sci
State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China
State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China
State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China

Article Navigation > Journal of Semiconductors > 2006 > 27(S1): 407-410

Liu Yufei, Liu Wenping, Li Sihua, Wu Yaming, Luo Le. Si-Glass Hermetic Package with the Benzo-Cyclo-Butene Material[J]. Journal of Semiconductors, 2006, 27(S1): 407-410. ****Liu Y F, Liu W P, Li S H, Wu Y M, Luo L. Si-Glass Hermetic Package with the Benzo-Cyclo-Butene Material[J]. Chin. J. Semicond., 2006, 27(13): 407.

Citation:

Liu Yufei, Liu Wenping, Li Sihua, Wu Yaming, Luo Le. Si-Glass Hermetic Package with the Benzo-Cyclo-Butene Material[J]. Journal of Semiconductors, 2006, 27(S1): 407-410. ****

Liu Y F, Liu W P, Li S H, Wu Y M, Luo L. Si-Glass Hermetic Package with the Benzo-Cyclo-Butene Material[J]. Chin. J. Semicond., 2006, 27(13): 407.

Citation:

Liu Yufei, Liu Wenping, Li Sihua, Wu Yaming, Luo Le. Si-Glass Hermetic Package with the Benzo-Cyclo-Butene Material[J]. Journal of Semiconductors, 2006, 27(S1): 407-410. ****

Liu Y F, Liu W P, Li S H, Wu Y M, Luo L. Si-Glass Hermetic Package with the Benzo-Cyclo-Butene Material[J]. Chin. J. Semicond., 2006, 27(13): 407.

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Si-Glass Hermetic Package with the Benzo-Cyclo-Butene Material

State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China
Graduate University of the Chinese Academy of Sci
State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China
Graduate University of the Chinese Academy of Sci
State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China
State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China
State Key Laboratory of Transducer Technology,National Key Laboratory of Microsystem Technology,Shanghai Institute ofMicrosystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China

Received Date: 2015-08-20

Abstract

Abstract

The characteristics of the wafer level low-temperature bonding with the benzo-cyclo-butene(BCB) material are studied experimentally and compared with the 300℃ anodic bonding.The results show that the bonding temperature with BCB is below 250℃,the hermeticity is (5.5±0.5)E-4Pa cc/s He,the shear strength is from 9.0 to 13.4MPa,and the yield is 100%.It shows that using the BCB material is an effective way for wafer level low-temperature hermetic package.According to the simplified seepage model,the relationship between the leakage rate and the distance from the hole to the device border is also studied.
- low-temperature bonding,
- hermetic package,
- benzo-cyclo-butene(BCB),
- seepage model

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