| Citation: |
Wang Libin, Liu Zhiqiang, Chen Yu, Yi Xiaoyan, Ma Long, Pan Lingfeng, Wang Liangchen. Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System[J]. Journal of Semiconductors, 2007, 28(S1): 504-508.
****
Wang L B, Liu Z Q, Chen Y, Yi X Y, Ma L, Pan L F, Wang L C. Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System[J]. Chin. J. Semicond., 2007, 28(S1): 504.
|
Thermal Simulation and Analysis of High Power Flip-Chip Light-Emitting Diode System
-
Abstract
In order to reduce the thermal resistance of LED system，the thermal property of high power flip-chip light-emitting diode is simulated by ANSYSl0 and analyzed.The results show that the bumps，Si-submount，case and heat-sink contribute little to the thermal resistance of LED system，but the thermal resistance of chip，adhesive and heat-sink to ambient are much larger，should be much concerned in thermal design of LED system.So optimizing the design of LED chip and heatsink，choosing adhesive with high thermal conductivity can reduce the thermal resistance of LED system effectively. -
References
-
Proportional views
DownLoad: