Chin. J. Semicond. > 2005, Volume 26 > Issue 5 > 1059-1064
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应用于MEMS的单晶硅上无电镀铜、镀镍工艺

韩翔 , 李轶 , 吴文刚 , 闫桂珍 and 郝一龙

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Key words: 单晶硅, 无电镀, 铜, 镍, MEMS电感, 品质因数

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    Received: 19 August 2015 Revised: Online: Published: 01 May 2005

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      Article Navigation >  Journal of Semiconductors  > 2005  >  26(5): 1059-1064
      韩翔, 李轶, 吴文刚, 闫桂珍, 郝一龙. 应用于MEMS的单晶硅上无电镀铜、镀镍工艺[J]. 半导体学报(英文版), 2005, 26(5): 1059-1064.
      Citation:
      韩翔, 李轶, 吴文刚, 闫桂珍, 郝一龙. 应用于MEMS的单晶硅上无电镀铜、镀镍工艺[J]. 半导体学报(英文版), 2005, 26(5): 1059-1064.
      shu

      • Received Date: 2015-08-19

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