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Journal of Semiconductors
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2026
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| Citation: |
Xing Chen, Dongchan Li, Desheng Kong. Enhancing Crack-Based Strain Sensors for Future Wearables and Robotics[J]. Journal of Semiconductors, 2026, In Press. doi: 10.1088/1674-4926/26040040
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X Chen, D C Li, and D S Kong, Enhancing Crack-Based Strain Sensors for Future Wearables and Robotics[J]. J. Semicond., 2026, accepted doi: 10.1088/1674-4926/26040040
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Enhancing Crack-Based Strain Sensors for Future Wearables and Robotics
DOI: 10.1088/1674-4926/26040040
CSTR: 32376.14.1674-4926.26040040
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References
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Proportional views



Xing Chen is currently a graduate student in the College of Chemical Engineering and Technology at Hebei University of Technology. His research focuses on the development and application of functional composite materials.
Dongchan Li is a Professor in the College of Chemical Engineering and Technology at Hebei University of Technology. Her research interests center on the design and synthesis of functional composite materials for flexible electronics and energy applications.
Desheng Kong is a Professor in the College of Engineering and Applied Sciences at Nanjing University and serves as an Associate Editor for npj Flexible Electronics. Dr. Kong's current research focuses on advanced materials, novel device designs, and system integration strategies for stretchable and bio-integrated electronic devices.
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