Fig. 1.
(Color online) (A) Comparison between conventional sintering with CVD coating (top) and the CuOM molecular conversion process (bottom). (B) Optical images of CuOM-derived conductor (sintered in air at 150 °C) and commercial Cu foil after identical corrosive exposure. (C) Freestanding Cu conductive paper and screen-printed circuit (inset). (D) Resistivity versus sintering temperature for reported Cu conductors[7].
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Journal of Semiconductors
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2026
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| Citation: |
Yuwei Su, Yu Wen, Ye Zhou. Molecularly engineered printable copper conductors for flexible electronics[J]. Journal of Semiconductors, 2026, In Press. doi: 10.1088/1674-4926/26050046
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Y W Su, Y Wen, and Y Zhou, Molecularly engineered printable copper conductors for flexible electronics[J]. J. Semicond., 2026, accepted doi: 10.1088/1674-4926/26050046
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Molecularly engineered printable copper conductors for flexible electronics
DOI: 10.1088/1674-4926/26050046
CSTR: 32376.14.1674-4926.26050046
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References
[1] Kim S J, Kim Y I, Lamichhane B, et al. Flat-surface-assisted and self-regulated oxidation resistance of Cu(111). Nature, 2022, 603: 434-8 doi: 10.1038/s41586-021-04375-5[2] Shim C, Lee S, Kong M, et al. Corrosion-resistant ultrathin Cu film deposited on N-doped amorphous carbon film substrate and its use for crumpleable circuit board. Adv Sci, 2024, 11: 2403587 doi: 10.1002/advs.202403587[3] Wang L, Qi J, Zhang S, et al. Abnormal anti-oxidation behavior of hexagonal boron nitride grown on copper. Nano Res, 2022, 15: 7577 doi: 10.1007/s12274-022-4388-1[4] Liao T, Liu B, Zhou H, et al. Near-theoretical oxidation resistance in copper powder enabled by scalable plasma-assisted few-layer graphene encapsulation. Adv Funct Mater, 2026, 36(27): e15549 doi: 10.1002/adfm.202515549[5] Khuje S, Alshatnawi F, Alhendi M, et al. 2023 High-temperature oxidation-resistant printed copper conductors. Adv Electron Mater, 2023, 9: 2200979 doi: 10.1002/aelm.202200979[6] Jeon I, Yang H, Lee S H, et al. Passivation of metal surface states: microscopic origin for uniform monolayer graphene by low temperature chemical vapor deposition. ACS Nano, 2011, 5(3): 1915 doi: 10.1021/nn102916c[7] Zhang J, Zhang Q, Feng Q, et al. A molecular pathway to corrosion-resistant printable copper. Science, 2026, 392: 766 doi: 10.1126/science.aed4488[8] Al-waeel M, Lukkari J, Kivelä H, et al. Heterogenous copper(0)-assisted dopamine oxidation: A new pathway to controllable and scalable polydopamine synthesis. Langmuir, 2024, 40: 20133-48 doi: 10.1021/acs.langmuir.4c02460[9] He L, Huang J, Zheng W, et al. A ligand oxidation structure-adaptive strategy for copper passivation. Nat Commun, 2025, 16: 7615 doi: 10.1038/s41467-025-62603-2[10] Goh G L, Lee S Z H, Goh D J S, et al. Printing 3D metallic structures through reduction processes: principle, approaches, and applications. Progress in Materials Science, 2026, 157: 101610 doi: 10.1016/j.pmatsci.2025.101610 -
Proportional views



Yuwei Su got her BS from Fuzhou University in 2022. Currently, she is a master student at Shenzhen University under the supervision of Prof. Ye Zhou. Her research focuses on memristors.
Yu Wen got her BS from Chengdu University of Technology in 2024. Currently, she is a master student at Shenzhen University under the supervision of Prof. Ye Zhou. Her research focuses on memristors.
Prof. Ye Zhou is a Distinguished Professor in the Institute for Advanced Study, Shenzhen University, China. He was elected as Fellow of the Royal Society of Chemistry (FRSC) in 2021, Fellow of the Institute of Physics (FInstP) and Fellow of the Institution of Engineering and Technology (FIET) in 2022. He received his B.S. from Nanjing University, M.S. from Hong Kong University of Science and Technology and Ph.D. from City University of Hong Kong. His research interests include neuromorphic materials, devices and systems.
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