J. Semicond. > 2010, Volume 31 > Issue 12 > 126001
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SEMICONDUCTOR TECHNOLOGY

Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity in CMP

Wang Cailing, Kang Renke, Jin Zhuji and Guo Dongming

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DOI: 10.1088/1674-4926/31/12/126001

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Abstract: Based on the Preston equation, the mathematical model of the material removal rate (MRR), aiming at a line-orbit chemical mechanical polisher, is established. The MRR and the material removal non-uniformity (MRNU) are numerically calculated by MATLAB, and the effects of the reciprocating parameters on the MRR and the MRNU are discussed. It is shown that the smaller the inclination angle and the larger the amplitude, the higher the MRR and the lower the MRNU. The reciprocating speed of the carrier plays a minor role to improve the MRR and decrease the MRNU. The results provide a guide for the design of a polisher and the determination of a process in line-orbit chemical mechanical polishing.

Key words: chemical mechanical polishing, reciprocating parameters, material removal rate, material removal non-uniformity

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    Received: 18 August 2015 Revised: 14 July 2010 Online: Published: 01 December 2010

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      Article Navigation >  Journal of Semiconductors  > 2010  >  31(12): 126001
      Wang Cailing, Kang Renke, Jin Zhuji, Guo Dongming. Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity in CMP[J]. Journal of Semiconductors, 2010, 31(12): 126001. doi: 10.1088/1674-4926/31/12/126001 ****Wang C L, Kang R K, Jin Z J, Guo D M. Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity in CMP[J]. J. Semicond., 2010, 31(12): 126001. doi:  10.1088/1674-4926/31/12/126001.
      Citation:
      Wang Cailing, Kang Renke, Jin Zhuji, Guo Dongming. Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity in CMP[J]. Journal of Semiconductors, 2010, 31(12): 126001. doi: 10.1088/1674-4926/31/12/126001 ****
      Wang C L, Kang R K, Jin Z J, Guo D M. Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity in CMP[J]. J. Semicond., 2010, 31(12): 126001. doi:  10.1088/1674-4926/31/12/126001.
      shu

      Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity in CMP

      DOI: 10.1088/1674-4926/31/12/126001

      • Key Laboratory for Precision & Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China

      • Key Laboratory for Precision & Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China

      • Key Laboratory for Precision & Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China

      • Key Laboratory for Precision & Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China

      • Received Date: 2015-08-18
      • Accepted Date: 2010-05-12
      • Revised Date: 2010-07-14
      • Published Date: 2010-11-25

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