
SEMICONDUCTOR TECHNOLOGY
Abstract: Bymeans of analyzing the I–V characteristic curve of NiSi/n-Si Schottky junction diodes (NiSi/n-Si SJDs), abstracting the effective Schottky barrier height (φB, eff) and the ideal factor of NiSi/n-Si SJDs and measuring the sheet resistance of NiSi films (RNiSi), we study the effects of different dopant segregation process parameters, including impurity implantation dose, segregation annealing temperature and segregation annealing time, on theφB, eff of NiSi/n-Si SJDs and the resistance characteristic of NiSi films. In addition, the changing rules of φB, eff and RNiSi are discussed.
Key words: NiSi/n-Si SJD, effective Schottky barrier height, dopant segregation process
1 |
V. Rajagopal Reddy, B. Asha, Chel-Jong Choi Journal of Semiconductors, 2017, 38(6): 064001. doi: 10.1088/1674-4926/38/6/064001 |
2 |
A high-conductivity insulated gate bipolar transistor with Schottky hole barrier contact Mengxuan Jiang, Z. John Shen, Jun Wang, Xin Yin, Zhikang Shuai, et al. Journal of Semiconductors, 2016, 37(2): 024011. doi: 10.1088/1674-4926/37/2/024011 |
3 |
Effect of ultrasound on reverse leakage current of silicon Schottky barrier structure O.Ya Olikh, K.V. Voitenko, R.M. Burbelo, JaM. Olikh Journal of Semiconductors, 2016, 37(12): 122002. doi: 10.1088/1674-4926/37/12/122002 |
4 |
Lara Valentic, Nima E. Gorji Journal of Semiconductors, 2015, 36(9): 094012. doi: 10.1088/1674-4926/36/9/094012 |
5 |
Kamal Zeghdar, Lakhdar Dehimi, Achour Saadoune, Nouredine Sengouga Journal of Semiconductors, 2015, 36(12): 124002. doi: 10.1088/1674-4926/36/12/124002 |
6 |
Tan Hairen, You Jingbi, Zhang Shuguang, Gao Hongli, Yin Zhigang, et al. Journal of Semiconductors, 2011, 32(10): 102002. doi: 10.1088/1674-4926/32/10/102002 |
7 |
Jie Binbin, Sah Chihtang Journal of Semiconductors, 2011, 32(12): 121001. doi: 10.1088/1674-4926/32/12/121001 |
8 |
Fabrication and characteristics of a 4H-SiC junction barrier Schottky diode Chen Fengping, Zhang Yuming, Lü Hongliang, Zhang Yimen, Guo Hui, et al. Journal of Semiconductors, 2011, 32(6): 064003. doi: 10.1088/1674-4926/32/6/064003 |
9 |
Physical effect on transition from blocking to conducting state of barrier-type thyristor Li Hairong, Li Siyuan Journal of Semiconductors, 2010, 31(12): 124003. doi: 10.1088/1674-4926/31/12/124003 |
10 |
Zhang Yong, Yang Jianhong, Cai Xueyuan, Wang Zaixing Journal of Semiconductors, 2010, 31(4): 044002. doi: 10.1088/1674-4926/31/4/044002 |
11 |
M. A. Yeganeh, S. H. Rahmatollahpur Journal of Semiconductors, 2010, 31(7): 074001. doi: 10.1088/1674-4926/31/7/074001 |
12 |
Design of an ultra-low-power digital processor for passive UHF RFID tags Shi Wanggen, Zhuang Yiqi, Li Xiaoming, Wang Xianghua, Jin Zhao, et al. Journal of Semiconductors, 2009, 30(4): 045004. doi: 10.1088/1674-4926/30/4/045004 |
13 |
Optimized design of 4H-SiC floating junction power Schottky barrier diodes Pu Hongbin, Cao Lin, Chen Zhiming, Ren Jie Journal of Semiconductors, 2009, 30(4): 044001. doi: 10.1088/1674-4926/30/4/044001 |
14 |
(NH4)2S treatment of the Si (100) surface and its effects on Al/Si Schottky barrier heights Hu Aibin, Wang Wenwu, Xu Qiuxia Journal of Semiconductors, 2009, 30(8): 084001. doi: 10.1088/1674-4926/30/8/084001 |
15 |
Adjustment of NiSi/n-Si SBH by post-silicide of dopant segregation process Shang Haiping, Xu Qiuxia Journal of Semiconductors, 2009, 30(10): 106001. doi: 10.1088/1674-4926/30/10/106001 |
16 |
Effect of Pt Addition on the Stress of NiSi Film Formed on Si (100) Huang Wei, Ru Guoping, Detavernier C, Van Meirhaeghe R L, Jiang Yulong, et al. Chinese Journal of Semiconductors , 2007, 28(5): 635-639. |
17 |
Study of NiSi/Si Interface by Cross-Section Transmission Electron Microscopy Jiang Yulong, Ru Guoping, Qu Xinping, Li Bingzong Chinese Journal of Semiconductors , 2006, 27(2): 223-228. |
18 |
Amorphization Implant Technology in NiSi SALICIDE Process Jiang Yulong, Ru Guoping, Qu Xinping, Li Bingzong Chinese Journal of Semiconductors , 2006, 27(S1): 385-388. |
19 |
Design and Fabrication of Schottky Diode with Standard CMOS Process Li Qiang, Wang Junyu, Han Yifeng,and Min Hao Chinese Journal of Semiconductors , 2005, 26(2): 238-242. |
20 |
Anealing Effect on Cu/ Ni/4H-SiC Schottky Barrier Yang Weifeng, Yang Keqin, Chen Xiaping, Zhang Feng, Wang Liangjun, et al. Chinese Journal of Semiconductors , 2005, 26(S1): 277-280. |
Article views: 3638 Times PDF downloads: 1800 Times Cited by: 0 Times
Received: 18 August 2015 Revised: 07 January 2010 Online: Published: 01 May 2010
Citation: |
Shang Haiping, Xu Qiuxia. SBH adjustment characteristic of the dopant segregation process for NiSi/n-Si SJDs[J]. Journal of Semiconductors, 2010, 31(5): 056001. doi: 10.1088/1674-4926/31/5/056001
****
Shang H P, Xu Q X. SBH adjustment characteristic of the dopant segregation process for NiSi/n-Si SJDs[J]. J. Semicond., 2010, 31(5): 056001. doi: 10.1088/1674-4926/31/5/056001.
|
Journal of Semiconductors © 2017 All Rights Reserved 京ICP备05085259号-2