| Citation: |
Huang Yuyang, Zhang Yuxiang, Yin Zhizhen, Cui Guoxin, Liu H C, Bian Lifeng, Yang Hui, Zhang Yaohui. Indium bump array fabrication on small CMOS circuit for flip-chip bonding[J]. Journal of Semiconductors, 2011, 32(11): 115014. doi: 10.1088/1674-4926/32/11/115014
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Huang Y Y, Zhang Y X, Yin Z Z, Cui G X, Liu H C, Bian L F, Yang H, Zhang Y H. Indium bump array fabrication on small CMOS circuit for flip-chip bonding[J]. J. Semicond., 2011, 32(11): 115014. doi: 10.1088/1674-4926/32/11/115014.
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Indium bump array fabrication on small CMOS circuit for flip-chip bonding
DOI: 10.1088/1674-4926/32/11/115014
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Abstract
We demonstrate a novel method for indium bump fabrication on a small CMOS circuit chip that is to be flip-chip bonded with a GaAs/AlGaAs multiple quantum well spatial light modulator. A chip holder with a via hole is used to coat the photoresist for indium bump lift-off. The 1000 μm-wide photoresist edge bead around the circuit chip can be reduced to less than 500 μm, which ensures the integrity of the indium bump array. 64 × 64 indium arrays with 20 μm-high, 30 μm-diameter bumps are successfully formed on a 5 × 6.5 mm2 CMOS chip.-
Keywords:
- flip-chip bonding
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References
[1] [2] [3] [4] [5] [6] [7] [8] -
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