Citation: |
Cheng Junji, Chen Xingbi. Hot-carrier reliability in OPTVLD-LDMOS[J]. Journal of Semiconductors, 2012, 33(6): 064003. doi: 10.1088/1674-4926/33/6/064003
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Cheng J J, Chen X B. Hot-carrier reliability in OPTVLD-LDMOS[J]. J. Semicond., 2012, 33(6): 064003. doi: 10.1088/1674-4926/33/6/064003.
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Abstract
An improved structure that eliminates hot-carrier effects (HCE) in optimum variation lateral doping (OPTVLD) LDMOS is proposed. A formula is proposed showing that the surface electric field intensity of the conventional structure is strong enough to make a hot-carrier injected into oxide. However, the proposed structure effectively reduces the maximum surface electric field from 268 to 100 kV/cm and can be realized without changing any process, and thereby reduces HCE significantly. -
References
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