Abstract: Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.A cell library method,as an alternative conventional FEM simulation,is introduced here to simplify the package-device co-design and the parametric study of MEMS components.Effects of the die bonding process on the pull-in voltage of a doubly supported micro-beam are predicted using this method, and the results are in good agreement with the FEM calculations.This method has the advantages of simplicity and accuracy and application to the co-design of the overall system of the packaged MEMS devices.

Key words: MEMS package, co-design, die bonding, cell library, step-up anchor