Chin. J. Semicond. > 2005, Volume 26 > Issue 6 > 1273-1277

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芯片叠层封装的失效分析和热应力模拟

顾靖 , 王珺 , 陆震 , 俞宏坤 and 肖斐

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Key words: 叠层封装, 高温高湿加速试验, 分层, 芯片裂纹, 有限元模拟

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    Received: 19 August 2015 Revised: Online: Published: 01 June 2005

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      Article Navigation >  Journal of Semiconductors  > 2005  >  26(6): 1273-1277
      顾靖, 王珺, 陆震, 俞宏坤, 肖斐. 芯片叠层封装的失效分析和热应力模拟[J]. 半导体学报(英文版), 2005, 26(6): 1273-1277.
      Citation:
      顾靖, 王珺, 陆震, 俞宏坤, 肖斐. 芯片叠层封装的失效分析和热应力模拟[J]. 半导体学报(英文版), 2005, 26(6): 1273-1277.
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      • Received Date: 2015-08-19

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