Chin. J. Semicond. > 2001, Volume 22 > Issue 10 > 1335-1342
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倒扣芯片连接底充胶分层和焊点失效

徐步陆 , 张群 , 彩霞 , 黄卫东 , 谢晓明 and 程兆年

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Key words: 倒扣芯片技术, 底充胶, 有限元模拟, 能量释放率, 界面分层与裂缝扩展

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    Received: 20 August 2015 Revised: Online: Published: 01 October 2001

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      Article Navigation >  Journal of Semiconductors  > 2001  >  22(10): 1335-1342
      徐步陆, 张群, 彩霞, 黄卫东, 谢晓明, 程兆年. 倒扣芯片连接底充胶分层和焊点失效[J]. 半导体学报(英文版), 2001, 22(10): 1335-1342.
      Citation:
      徐步陆, 张群, 彩霞, 黄卫东, 谢晓明, 程兆年. 倒扣芯片连接底充胶分层和焊点失效[J]. 半导体学报(英文版), 2001, 22(10): 1335-1342.
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      • Received Date: 2015-08-20

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