Chin. J. Semicond. > 2006, Volume 27 > Issue 11 > 2051-2055

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Impurity Distribution of Silicon Direct Bonding

Chen Xin'an and Huang Qing'an

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Abstract: There is a thin layer of native oxide between two directly bonded silicon wafers.The silicon extracts impurity from the oxide,thus drastically decreasing the impurity concentration at the interface of SiO2-Si.Based on the modified model of silicon direct bonding,an expression of impurity distribution is derived and verified by theory and experiment.Finally,it is found that the total impurity in silicon with oxide is much less than that without oxide,which decreases the junction depth of p-n+ junction.

Key words: silicon direct bonding extractive effect native oxide

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    Received: 18 August 2015 Revised: Online: Published: 01 November 2006

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      Chen Xin'an, Huang Qing'an. Impurity Distribution of Silicon Direct Bonding[J]. Journal of Semiconductors, 2006, 27(11): 2051-2055. ****Chen X, Huang Q. Impurity Distribution of Silicon Direct Bonding[J]. Chin. J. Semicond., 2006, 27(11): 2051.
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      Chen Xin'an, Huang Qing'an. Impurity Distribution of Silicon Direct Bonding[J]. Journal of Semiconductors, 2006, 27(11): 2051-2055. ****
      Chen X, Huang Q. Impurity Distribution of Silicon Direct Bonding[J]. Chin. J. Semicond., 2006, 27(11): 2051.

      Impurity Distribution of Silicon Direct Bonding

      • Received Date: 2015-08-18

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