Citation: |
Sun Shilong, 刘彩池, Liu Caichi, Hao Qiuyan, Teng Xiaoyun, Zhao Liwei, Zhao Yanqiao, Wang Lijian. Effect of Rapid Thermal Process on Oxygen Precipitatesin Heavily As-Doped Wafer[J]. Journal of Semiconductors, 2006, 27(S1): 165-168.
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Sun S L, Liu C C, Hao Q Y, Teng X Y, Zhao L W, Zhao Y Q, Wang L J. Effect of Rapid Thermal Process on Oxygen Precipitatesin Heavily As-Doped Wafer[J]. Chin. J. Semicond., 2006, 27(13): 165.
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Effect of Rapid Thermal Process on Oxygen Precipitatesin Heavily As-Doped Wafer
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Abstract
Rapid thermal process (RTP) is performed to heavily-As doped silicon wafer.It is found that the density of oxygen precipitates increases slowly with the increase of the RTP temperature,the cooling rate, and the RTP time. -
References
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Proportional views