Chin. J. Semicond. > 2004, Volume 25 > Issue 2 > 232-236
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有限元方法对SCSP粘结剂溢出问题的研究

金玮 , 桑文斌 , 张奇 and 滕建勇

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Key words: SCSP, 溢出高度, 分层, 有限元方法

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    Received: 19 August 2015 Revised: Online: Published: 01 February 2004

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      Article Navigation >  Journal of Semiconductors  > 2004  >  25(2): 232-236
      金玮, 桑文斌, 张奇, 滕建勇. 有限元方法对SCSP粘结剂溢出问题的研究[J]. 半导体学报(英文版), 2004, 25(2): 232-236.
      Citation:
      金玮, 桑文斌, 张奇, 滕建勇. 有限元方法对SCSP粘结剂溢出问题的研究[J]. 半导体学报(英文版), 2004, 25(2): 232-236.
      shu

      • Received Date: 2015-08-19

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