Chin. J. Semicond. > 2001, Volume 22 > Issue 7 > 924-928
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智能剥离SOI高温压力传感器

黄宜平 , 竺士炀 , 李爱珍 , 鲍敏杭 , 沈绍群 , 王瑾 and 吴东平

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Key words: SOI, 压力传感器, 低温键合, 智能剥离, 高温

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    Received: 20 August 2015 Revised: Online: Published: 01 July 2001

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      Article Navigation >  Journal of Semiconductors  > 2001  >  22(7): 924-928
      黄宜平, 竺士炀, 李爱珍, 鲍敏杭, 沈绍群, 王瑾, 吴东平. 智能剥离SOI高温压力传感器[J]. 半导体学报(英文版), 2001, 22(7): 924-928.
      Citation:
      黄宜平, 竺士炀, 李爱珍, 鲍敏杭, 沈绍群, 王瑾, 吴东平. 智能剥离SOI高温压力传感器[J]. 半导体学报(英文版), 2001, 22(7): 924-928.
      shu

      • Received Date: 2015-08-20

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