Chin. J. Semicond. > 2001, Volume 22 > Issue 10 > 1343-1345

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Key words: 可靠性, 缺陷, 互连线寿命, IC设计

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    Received: 20 August 2015 Revised: Online: Published: 01 October 2001

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      陈太峰, 郝跃, 赵天绪, 张进城. 基于缺陷统计分布的IC互连线可靠性模型[J]. 半导体学报(英文版), 2001, 22(10): 1343-1345.
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      陈太峰, 郝跃, 赵天绪, 张进城. 基于缺陷统计分布的IC互连线可靠性模型[J]. 半导体学报(英文版), 2001, 22(10): 1343-1345.

      • Received Date: 2015-08-20

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