Chin. J. Semicond. > 2002, Volume 23 > Issue 11 > 1121-1134

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超深亚微米集成电路中的互连问题——低k介质与Cu的互连集成技术

王阳元 and 康晋锋

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Key words: 互连集成技术, 互连的限制和挑战, 低k介质, Cu互连, 三维集成互连, RF互连, 光互连

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    Received: 19 August 2015 Revised: Online: Published: 01 November 2002

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      Article Navigation >  Journal of Semiconductors  > 2002  >  23(11): 1121-1134
      王阳元, 康晋锋. 超深亚微米集成电路中的互连问题——低k介质与Cu的互连集成技术[J]. 半导体学报(英文版), 2002, 23(11): 1121-1134.
      Citation:
      王阳元, 康晋锋. 超深亚微米集成电路中的互连问题——低k介质与Cu的互连集成技术[J]. 半导体学报(英文版), 2002, 23(11): 1121-1134.
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      • Received Date: 2015-08-19

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