
PAPERS
Abstract: A new system for thein situ extraction of the material parameters of MEMS films is presented. The system is composed of three parts,including the layout of testing structures,test equipments,and a software application for analysis and control.Both the test and measurement signals of the test system are electrical,making it compatible with IC testing and capable for rapid testing.The measurement is executed automatically under the control of a computer.
Key words: MEMS, film, material parameter, in situ
1 |
Temperature sensor based on composite film of vanadium complex (VO2(3-fl)) and CNT Kh. S. Karimov, M. Mahroof-Tahir, M. Saleem, M. Tariq Saeed Chani, A. Khan Niaz, et al. Journal of Semiconductors, 2015, 36(7): 073004. doi: 10.1088/1674-4926/36/7/073004 |
2 |
In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip Yuelin Wang, Tie Li, Xiao Zhang, Hongjiang Zeng, Qinhua Jin, et al. Journal of Semiconductors, 2014, 35(8): 081001. doi: 10.1088/1674-4926/35/8/081001 |
3 |
Design and fabrication of a MEMS Lamb wave device based on ZnO thin film Liu Mengwei, Li Junhong, Ma Jun, Wang Chenghao Journal of Semiconductors, 2011, 32(4): 044006. doi: 10.1088/1674-4926/32/4/044006 |
4 |
Liu Tong, Liao Xiaoping, Wang Debo Journal of Semiconductors, 2011, 32(7): 074009. doi: 10.1088/1674-4926/32/7/074009 |
5 |
Characteristics of a novel biaxial capacitive MEMS accelerometer Dong Linxi, Li Yongjie, Yan Haixia, Sun Lingling Journal of Semiconductors, 2010, 31(5): 054006. doi: 10.1088/1674-4926/31/5/054006 |
6 |
Xie Jing, Liu Yunfei, Yang Jinling, Tang Longjuan, Yang Fuhua, et al. Journal of Semiconductors, 2009, 30(8): 083003. doi: 10.1088/1674-4926/30/8/083003 |
7 |
A capacitive membrane MEMS microwave power sensor in the X-band based on GaAs MMIC technology Su Shi, Liao Xiaoping Journal of Semiconductors, 2009, 30(5): 054004. doi: 10.1088/1674-4926/30/5/054004 |
8 |
Design and fabrication of a terminating type MEMS microwave power sensor Xu Yinglin, Liao Xiaoping Journal of Semiconductors, 2009, 30(4): 044010. doi: 10.1088/1674-4926/30/4/044010 |
9 |
Thermal time constant of a terminating type MEMS microwave power sensor Xu Yinglin, Liao Xiaoping Journal of Semiconductors, 2009, 30(10): 104006. doi: 10.1088/1674-4926/30/10/104006 |
10 |
System-Level Modeling and Simulation of Force-Balance MEMS Accelerometers Zhang Yufeng, Liu Xiaowei, Chen Weiping Journal of Semiconductors, 2008, 29(5): 917-922. |
11 |
Thermally Induced Packaging Effect on the Resonant Frequencies of a Fixed-Fixed Beam Li Ming, Song Jing, Huang Qing’an, Tang Jieying Journal of Semiconductors, 2008, 29(1): 157-162. |
12 |
A Novel Capacitive Biaxial Microaccelerometer Based on the Slide-Film Damping Effect Dong Linxi, Yan Haixia, Qian Xian, Sun Lingling Journal of Semiconductors, 2008, 29(2): 219-223. |
13 |
An Electrostatic MEMS Actuator with Large Displacement Under Low Driving Voltage Ming Anjie, Li Tie, Zhou Ping, Wang Yuelin Journal of Semiconductors, 2008, 29(9): 1703-1707. |
14 |
MEMS/CMOS Compatible Gas Sensors Based on Spectroscopy Analysis Gao Chaoqun, Jiao Binbin, Liu Maozhe, Li Quanbao, Yang Kai, et al. Journal of Semiconductors, 2008, 29(10): 2043-2049. |
15 |
MEMS Shocking-Acceleration Switch with Threshold Modulating and On-State Latching Function Jia Mengjun, Li Xinxin, Song Zhaohui, Wang Yuelin Chinese Journal of Semiconductors , 2007, 28(8): 1295-1301. |
16 |
Design and Mechanical Characteristics of Novel MEMS Microneedles Sun Xiao, Jia Shuhai, Zhu Jun, Li Yigui Chinese Journal of Semiconductors , 2007, 28(1): 113-116. |
17 |
Design of a 2D Thermal Wind Sensor Based on MEMS Process Shen Guangping, Wu Jian, Zhang Hua, Qin Ming, Huang Qing’an, et al. Chinese Journal of Semiconductors , 2007, 28(11): 1830-1835. |
18 |
Modified Reynolds Equation for Squeeze-Film Air Damping of Slotted Plates in MEMS Devices Sun Yuancheng, Bao Minhang, Yang Heng, Huang Yiping Chinese Journal of Semiconductors , 2006, 27(3): 473-477. |
19 |
Wet Etching and Releasing of MEMS Ou Yi, Shi Shali, Li Chaobo, Jiao Binbin, Chen Dapeng, et al. Chinese Journal of Semiconductors , 2006, 27(S1): 347-350. |
20 |
Jiang Zheng, Ding Guifu, Wang Yan, Zhang Dongmei, Wang Zhiming, et al. Chinese Journal of Semiconductors , 2006, 27(1): 143-149. |
Article views: 3209 Times PDF downloads: 2453 Times Cited by: 0 Times
Received: 18 August 2015 Revised: 04 April 2006 Online: Published: 01 September 2006
Citation: |
Huang Qing'an, Liu Zutao, Li Weihua, Li Qiaoping. A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J]. Journal of Semiconductors, 2006, 27(9): 1650-1656.
****
Huang Q, Liu Z T, Li W H, Li Q P. A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J]. Chin. J. Semicond., 2006, 27(9): 1650.
|
Journal of Semiconductors © 2017 All Rights Reserved 京ICP备05085259号-2