Chin. J. Semicond. > 2006, Volume 27 > Issue 9 > 1650-1656

PAPERS

A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films

Huang Qing'an, Liu Zutao, Li Weihua and Li Qiaoping

+ Author Affiliations

PDF

Abstract: A new system for thein situ extraction of the material parameters of MEMS films is presented. The system is composed of three parts,including the layout of testing structures,test equipments,and a software application for analysis and control.Both the test and measurement signals of the test system are electrical,making it compatible with IC testing and capable for rapid testing.The measurement is executed automatically under the control of a computer.

Key words: MEMSfilmmaterial parameterin situ

1

Temperature sensor based on composite film of vanadium complex (VO2(3-fl)) and CNT

Kh. S. Karimov, M. Mahroof-Tahir, M. Saleem, M. Tariq Saeed Chani, A. Khan Niaz, et al.

Journal of Semiconductors, 2015, 36(7): 073004. doi: 10.1088/1674-4926/36/7/073004

2

In situ TEM/SEM electronic/mechanical characterization of nano material with MEMS chip

Yuelin Wang, Tie Li, Xiao Zhang, Hongjiang Zeng, Qinhua Jin, et al.

Journal of Semiconductors, 2014, 35(8): 081001. doi: 10.1088/1674-4926/35/8/081001

3

Design and fabrication of a MEMS Lamb wave device based on ZnO thin film

Liu Mengwei, Li Junhong, Ma Jun, Wang Chenghao

Journal of Semiconductors, 2011, 32(4): 044006. doi: 10.1088/1674-4926/32/4/044006

4

Sensitivity of MEMS microwave power sensor with the length of thermopile based on Fourier equivalent model

Liu Tong, Liao Xiaoping, Wang Debo

Journal of Semiconductors, 2011, 32(7): 074009. doi: 10.1088/1674-4926/32/7/074009

5

Characteristics of a novel biaxial capacitive MEMS accelerometer

Dong Linxi, Li Yongjie, Yan Haixia, Sun Lingling

Journal of Semiconductors, 2010, 31(5): 054006. doi: 10.1088/1674-4926/31/5/054006

6

Stress and resistivity controls on in situ boron doped LPCVD polysilicon films for high-Q MEMS applications

Xie Jing, Liu Yunfei, Yang Jinling, Tang Longjuan, Yang Fuhua, et al.

Journal of Semiconductors, 2009, 30(8): 083003. doi: 10.1088/1674-4926/30/8/083003

7

A capacitive membrane MEMS microwave power sensor in the X-band based on GaAs MMIC technology

Su Shi, Liao Xiaoping

Journal of Semiconductors, 2009, 30(5): 054004. doi: 10.1088/1674-4926/30/5/054004

8

Design and fabrication of a terminating type MEMS microwave power sensor

Xu Yinglin, Liao Xiaoping

Journal of Semiconductors, 2009, 30(4): 044010. doi: 10.1088/1674-4926/30/4/044010

9

Thermal time constant of a terminating type MEMS microwave power sensor

Xu Yinglin, Liao Xiaoping

Journal of Semiconductors, 2009, 30(10): 104006. doi: 10.1088/1674-4926/30/10/104006

10

System-Level Modeling and Simulation of Force-Balance MEMS Accelerometers

Zhang Yufeng, Liu Xiaowei, Chen Weiping

Journal of Semiconductors, 2008, 29(5): 917-922.

11

Thermally Induced Packaging Effect on the Resonant Frequencies of a Fixed-Fixed Beam

Li Ming, Song Jing, Huang Qing’an, Tang Jieying

Journal of Semiconductors, 2008, 29(1): 157-162.

12

A Novel Capacitive Biaxial Microaccelerometer Based on the Slide-Film Damping Effect

Dong Linxi, Yan Haixia, Qian Xian, Sun Lingling

Journal of Semiconductors, 2008, 29(2): 219-223.

13

An Electrostatic MEMS Actuator with Large Displacement Under Low Driving Voltage

Ming Anjie, Li Tie, Zhou Ping, Wang Yuelin

Journal of Semiconductors, 2008, 29(9): 1703-1707.

14

MEMS/CMOS Compatible Gas Sensors Based on Spectroscopy Analysis

Gao Chaoqun, Jiao Binbin, Liu Maozhe, Li Quanbao, Yang Kai, et al.

Journal of Semiconductors, 2008, 29(10): 2043-2049.

15

MEMS Shocking-Acceleration Switch with Threshold Modulating and On-State Latching Function

Jia Mengjun, Li Xinxin, Song Zhaohui, Wang Yuelin

Chinese Journal of Semiconductors , 2007, 28(8): 1295-1301.

16

Design and Mechanical Characteristics of Novel MEMS Microneedles

Sun Xiao, Jia Shuhai, Zhu Jun, Li Yigui

Chinese Journal of Semiconductors , 2007, 28(1): 113-116.

17

Design of a 2D Thermal Wind Sensor Based on MEMS Process

Shen Guangping, Wu Jian, Zhang Hua, Qin Ming, Huang Qing’an, et al.

Chinese Journal of Semiconductors , 2007, 28(11): 1830-1835.

18

Modified Reynolds Equation for Squeeze-Film Air Damping of Slotted Plates in MEMS Devices

Sun Yuancheng, Bao Minhang, Yang Heng, Huang Yiping

Chinese Journal of Semiconductors , 2006, 27(3): 473-477.

19

Wet Etching and Releasing of MEMS

Ou Yi, Shi Shali, Li Chaobo, Jiao Binbin, Chen Dapeng, et al.

Chinese Journal of Semiconductors , 2006, 27(S1): 347-350.

20

A Teeterboard Pattern MEMS Permanent Magnet Bistable Structure Supported by Torsion and Cantilever Beam

Jiang Zheng, Ding Guifu, Wang Yan, Zhang Dongmei, Wang Zhiming, et al.

Chinese Journal of Semiconductors , 2006, 27(1): 143-149.

  • Search

    Advanced Search >>

    GET CITATION

    Huang Qing'an, Liu Zutao, Li Weihua, Li Qiaoping. A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J]. Journal of Semiconductors, 2006, 27(9): 1650-1656.
    Huang Q, Liu Z T, Li W H, Li Q P. A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J]. Chin. J. Semicond., 2006, 27(9): 1650.
    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 3209 Times PDF downloads: 2453 Times Cited by: 0 Times

    History

    Received: 18 August 2015 Revised: 04 April 2006 Online: Published: 01 September 2006

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Huang Qing'an, Liu Zutao, Li Weihua, Li Qiaoping. A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J]. Journal of Semiconductors, 2006, 27(9): 1650-1656. ****Huang Q, Liu Z T, Li W H, Li Q P. A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J]. Chin. J. Semicond., 2006, 27(9): 1650.
      Citation:
      Huang Qing'an, Liu Zutao, Li Weihua, Li Qiaoping. A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J]. Journal of Semiconductors, 2006, 27(9): 1650-1656. ****
      Huang Q, Liu Z T, Li W H, Li Q P. A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films[J]. Chin. J. Semicond., 2006, 27(9): 1650.

      A Test System for the in situ Extraction of the Material Parameters of MEMS Thin Films

      • Received Date: 2015-08-18
      • Accepted Date: 2006-02-05
      • Revised Date: 2006-04-04
      • Published Date: 2006-10-12

      Catalog

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return