Chin. J. Semicond. > 2001, Volume 22 > Issue 5 > 548-553
|

CONTENTS

一种用于功率模块热分布特性研究的精确模型(英文)

耿莉 , 陈治明 , R Kruemmer , T Reimann and J Petzoldt

+ Author Affiliations

PDF

Key words: 功率电子, IGBT模块, 热仿真, 热耦合

    • Search

    Advanced Search >>

    GET CITATION

    shu

    Export: BibTex EndNote

    Article Metrics

    Article views: 2519 Times PDF downloads: 1076 Times Cited by: 0 Times

    History

    Received: 20 August 2015 Revised: Online: Published: 01 May 2001

    Catalog

      Email This Article

      User name:
      Email:*请输入正确邮箱
      Code:*验证码错误
      Send
      Article Navigation >  Journal of Semiconductors  > 2001  >  22(5): 548-553
      耿莉, 陈治明, R Kruemmer, T Reimann, J Petzoldt. 一种用于功率模块热分布特性研究的精确模型(英文)[J]. 半导体学报(英文版), 2001, 22(5): 548-553.
      Citation:
      耿莉, 陈治明, R Kruemmer, T Reimann, J Petzoldt. 一种用于功率模块热分布特性研究的精确模型(英文)[J]. 半导体学报(英文版), 2001, 22(5): 548-553.
      shu

      • Received Date: 2015-08-20

      Catalog

        Journal of Semiconductors © 2017 All Rights Reserved   京ICP备05085259号-2

        /

        DownLoad:  Full-Size Img  PowerPoint
        Return
        Return