Chin. J. Semicond. > 2005, Volume 26 > Issue 7 > 1475-1479
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CdZnTe材料的表面钝化新工艺

王昆黍 , 桑文斌 , 闵嘉华 , 腾建勇 , 张奇 , 夏军 and 钱永彪

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Key words: CdZnTe晶体, 表面钝化, 漏电流

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    Received: 18 August 2015 Revised: Online: Published: 01 July 2005

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      Article Navigation >  Journal of Semiconductors  > 2005  >  26(7): 1475-1479
      王昆黍, 桑文斌, 闵嘉华, 腾建勇, 张奇, 夏军, 钱永彪. CdZnTe材料的表面钝化新工艺[J]. 半导体学报(英文版), 2005, 26(7): 1475-1479.
      Citation:
      王昆黍, 桑文斌, 闵嘉华, 腾建勇, 张奇, 夏军, 钱永彪. CdZnTe材料的表面钝化新工艺[J]. 半导体学报(英文版), 2005, 26(7): 1475-1479.
      shu

      • Received Date: 2015-08-18

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