Chin. J. Semicond. > 2004, Volume 25 > Issue 7 > 874-878
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vf-BGA封装焊球热疲劳可靠性的研究

和平 , 彭瑶玮 , 乌健波 , 孟宣华 and 何国伟

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Key words: 温度循环, 三维有限元模拟, 焊球剪切强度, 金属间化合物, 疲劳寿命

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    Received: 19 August 2015 Revised: Online: Published: 01 July 2004

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      Article Navigation >  Journal of Semiconductors  > 2004  >  25(7): 874-878
      和平, 彭瑶玮, 乌健波, 孟宣华, 何国伟. vf-BGA封装焊球热疲劳可靠性的研究[J]. 半导体学报(英文版), 2004, 25(7): 874-878.
      Citation:
      和平, 彭瑶玮, 乌健波, 孟宣华, 何国伟. vf-BGA封装焊球热疲劳可靠性的研究[J]. 半导体学报(英文版), 2004, 25(7): 874-878.
      shu

      • Received Date: 2015-08-19

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