Chin. J. Semicond. > 2003, Volume 24 > Issue 11 > 1185-1190
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两端固支多层梁吸合电压的解析模型

戎华 , 黄庆安 , 聂萌 and 李伟华

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Key words: 两端固支多层梁, 能量法, 挠度, 吸合

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    Received: 20 August 2015 Revised: Online: Published: 01 November 2003

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      Article Navigation >  Journal of Semiconductors  > 2003  >  24(11): 1185-1190
      戎华, 黄庆安, 聂萌, 李伟华. 两端固支多层梁吸合电压的解析模型[J]. 半导体学报(英文版), 2003, 24(11): 1185-1190.
      Citation:
      戎华, 黄庆安, 聂萌, 李伟华. 两端固支多层梁吸合电压的解析模型[J]. 半导体学报(英文版), 2003, 24(11): 1185-1190.
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      • Received Date: 2015-08-20

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