Chin. J. Semicond. > 2005, Volume 26 > Issue 6 > 1239-1244
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用低温金属电镀技术制造与封装的惯性微型电学开关

马薇 , Yitshak , Zohar and 王文

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Key words: 惯性微型开关, 阈值加速度, 电镀, 封装, 共晶焊料熔接, 密封性

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    Received: 19 August 2015 Revised: Online: Published: 01 June 2005

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      Article Navigation >  Journal of Semiconductors  > 2005  >  26(6): 1239-1244
      马薇, Yitshak, Zohar, 王文. 用低温金属电镀技术制造与封装的惯性微型电学开关[J]. 半导体学报(英文版), 2005, 26(6): 1239-1244.
      Citation:
      马薇, Yitshak, Zohar, 王文. 用低温金属电镀技术制造与封装的惯性微型电学开关[J]. 半导体学报(英文版), 2005, 26(6): 1239-1244.
      shu

      • Received Date: 2015-08-19

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