Chin. J. Semicond. > 2005, Volume 26 > Issue 6 > 1239-1244

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用低温金属电镀技术制造与封装的惯性微型电学开关

马薇 , Yitshak , Zohar and 王文

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Key words: 惯性微型开关阈值加速度电镀封装共晶焊料熔接密封性

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    Received: 19 August 2015 Revised: Online: Published: 01 June 2005

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      马薇, Yitshak, Zohar, 王文. 用低温金属电镀技术制造与封装的惯性微型电学开关[J]. 半导体学报(英文版), 2005, 26(6): 1239-1244.
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      马薇, Yitshak, Zohar, 王文. 用低温金属电镀技术制造与封装的惯性微型电学开关[J]. 半导体学报(英文版), 2005, 26(6): 1239-1244.

      • Received Date: 2015-08-19

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