Chin. J. Semicond. > Volume 19 > Issue 8 > Article Number: 609

功率循环中表面安装器件(SMD)热变形的实时全息干涉测量研究

王卫宁 and 梁镜明

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Abstract: 功率循环中表面安装器件(SMD)的热应变是影响SMD焊点可靠性的重要因素之一.本文采用实时全息干涉度量法对一个具有100条引线的塑料四边引线封装器件(PQFP)在功率循环中的热-力耦合离面变形场进行了测量,获得了分别位于PQFP和印制电路版(PCB)表面的离面变形数值,并根据两者之间的离变形失配,精确地计算出了引线和焊点的变形,为全面了解SMD在功率循环条件下的热力学行为及分析SMD焊点的疲劳失效机理提供了精确可靠的实验数据.

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History

Manuscript received: 18 August 2015 Manuscript revised: Online: Published: 01 August 1998

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