Citation: |
Chi-Hang Chan, Lin Cheng, Wei Deng, Peng Feng, Li Geng, Mo Huang, Haikun Jia, Lu Jie, Ka-Meng Lei, Xihao Liu, Xun Liu, Yongpan Liu, Yan Lu, Kaiming Nie, Dongfang Pan, Nan Qi, Sai-Weng Sin, Nan Sun, Wenyu Sun, Jiangtao Xu, Jinshan Yue, Milin Zhang, Zhao Zhang. Trending IC design directions in 2022[J]. Journal of Semiconductors, 2022, 43(7): 071401. doi: 10.1088/1674-4926/43/7/071401
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Chi-Hang Chan, Lin Cheng, Wei Deng, Peng Feng, Li Geng, Mo Huang, Haikun Jia, Lu Jie, Ka-Meng Lei, Xihao Liu, Xun Liu, Yongpan Liu, Yan Lu, Kaiming Nie, Dongfang Pan, Nan Qi, Sai-Weng Sin, Nan Sun, Wenyu Sun, Jiangtao Xu, Jinshan Yue, Milin Zhang, Zhao Zhang, Trending IC design directions in 2022[J]. Journal of Semiconductors, 2022, 43(7), 071401 doi: 10.1088/1674-4926/43/7/071401
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Abstract
For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works. -
References
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