| Citation: |
Huang Chenhung, Chiou Herngde. Direct Bonded SOI Wafers Technology[J]. Journal of Semiconductors, 2006, 27(S1): 392-395.
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Huang C H N, Chiou H. Direct Bonded SOI Wafers Technology[J]. Chin. J. Semicond., 2006, 27(13): 392.
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Direct Bonded SOI Wafers Technology
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Abstract
This paper reports the direct bonded SOI wafers technology.It discusses how the wafer cleanliness and surface flatness result in the voids of bonded SOI wafers.By growing oxide on different layer of bonded wafers,we demonstrate the warpage variation.Dimples on wafers results in the bonding voids,which can be inspected by infrared light.-
Keywords:
- bonded wafers,
- SOI,
- voids
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References
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Proportional views
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