Chin. J. Semicond. > 2001, Volume 22 > Issue 2 > 140-144
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直接键合硅片界面键合能的理论分析

韩伟华 , 余金中 and 王启明

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Key words: 键合能, 激活能, 退火

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    Received: 19 August 2015 Revised: Online: Published: 01 February 2001

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      Article Navigation >  Journal of Semiconductors  > 2001  >  22(2): 140-144
      韩伟华, 余金中, 王启明. 直接键合硅片界面键合能的理论分析[J]. 半导体学报(英文版), 2001, 22(2): 140-144.
      Citation:
      韩伟华, 余金中, 王启明. 直接键合硅片界面键合能的理论分析[J]. 半导体学报(英文版), 2001, 22(2): 140-144.
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      • Received Date: 2015-08-19

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