Chin. J. Semicond. > 1997, Volume 18 > Issue 9 > 710-713
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硅片高温翘曲与常温机械强度

谢书银 , 石志仪 , 陈忠祥 and 张维连

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    Received: 19 August 2015 Revised: Online: Published: 01 September 1997

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      Article Navigation >  Journal of Semiconductors  > 1997  >  18(9): 710-713
      谢书银, 石志仪, 陈忠祥, 张维连. 硅片高温翘曲与常温机械强度[J]. 半导体学报(英文版), 1997, 18(9): 710-713.
      Citation:
      谢书银, 石志仪, 陈忠祥, 张维连. 硅片高温翘曲与常温机械强度[J]. 半导体学报(英文版), 1997, 18(9): 710-713.
      shu

      • Received Date: 2015-08-19

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