Chin. J. Semicond. > Volume 13 > Issue 6 > Article Number: 379

集成电路塑封应力的压阻测试

陈健 , 鲍敏杭 , 胡澄宇 , 李善君 , 谢静薇 and 郑国荣

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Abstract: 本文提出了一种用于测量集成电路塑封附加应力的十字型压阻测试图形设计,用它可同时测量芯片平面内的两个正应力及剪切应力,比现有的几种方法更加合理可靠.用这种测试器件对国产塑封料和进口塑封料进行了对比应力测试,所得结果为国产塑封料配方及塑封工艺的改进提供了性能参数.

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History

Manuscript received: 19 August 2015 Manuscript revised: Online: Published: 01 June 1992

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