Citation: |
Wenguo Ning, Heng Li, Chunsheng Zhu, Le Luo, Dong Chen, Zhenzhen Duan. The effects of cure temperature history on the stability of polyimide films[J]. Journal of Semiconductors, 2013, 34(6): 063003. doi: 10.1088/1674-4926/34/6/063003
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W G Ning, H Li, C S Zhu, L Luo, D Chen, Z Z Duan. The effects of cure temperature history on the stability of polyimide films[J]. J. Semicond., 2013, 34(6): 063003. doi: 10.1088/1674-4926/34/6/063003.
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The effects of cure temperature history on the stability of polyimide films
DOI: 10.1088/1674-4926/34/6/063003
More Information
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Abstract
The effects of cure temperature history on the stability of hinged structure poly (4, 4-oxydiphenylene pyromellitimide) (PMDA-ODA) polyimide were studied by dynamic mechanical analysis. The polyimide films were cured under different curing conditions and peeled off by substrate etching. It was found that a proper cure time and temperature ramp rate improves the stability in terms of higher glass transition temperature. Ninety minutes at 375℃ or 200℃ is a beneficial high glass transition temperature. The temperature ramp rate should be between 2℃/min and 10℃/min, which is neither too high nor too low.-
Keywords:
- curing of polymers,
- polyimide,
- stabilization,
- DMA
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References
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