Fig. 1.
(a) Structure diagram of ceramic chip and (b) microscopic structure of ceramic chip.
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| Citation: |
Lin Zhou, Ming Qin, Shengqi Chen, Bei Chen. Ceramic thermal wind sensor based on advanced direct chip attach package[J]. Journal of Semiconductors, 2014, 35(7): 074015. doi: 10.1088/1674-4926/35/7/074015
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L Zhou, M Qin, S Q Chen, B Chen. Ceramic thermal wind sensor based on advanced direct chip attach package[J]. J. Semicond., 2014, 35(7): 074015. doi: 10.1088/1674-4926/35/7/074015.
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Ceramic thermal wind sensor based on advanced direct chip attach package
DOI: 10.1088/1674-4926/35/7/074015
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Abstract
An advanced direct chip attach packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attach (DCA) packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics (CFD) model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor. -
References
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