Chin. J. Semicond. > 2004, Volume 25 > Issue 12 > 1634-1638
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Cu/Zr-Si-N/Si金属化系统制备及退火气氛对其热稳定性的影响

王颖 , 朱长纯 , 宋忠孝 and 刘君华

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Key words: 扩散阻挡层, 金属化, 退火

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    王颖, 朱长纯, 宋忠孝, 刘君华. Cu/Zr-Si-N/Si金属化系统制备及退火气氛对其热稳定性的影响[J]. 半导体学报(英文版), 2004, 25(12): 1634-1638.
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    Received: 19 August 2015 Revised: Online: Published: 01 December 2004

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      Article Navigation >  Journal of Semiconductors  > 2004  >  25(12): 1634-1638
      王颖, 朱长纯, 宋忠孝, 刘君华. Cu/Zr-Si-N/Si金属化系统制备及退火气氛对其热稳定性的影响[J]. 半导体学报(英文版), 2004, 25(12): 1634-1638.
      Citation:
      王颖, 朱长纯, 宋忠孝, 刘君华. Cu/Zr-Si-N/Si金属化系统制备及退火气氛对其热稳定性的影响[J]. 半导体学报(英文版), 2004, 25(12): 1634-1638.
      shu

      • Received Date: 2015-08-19

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